- TOKYO, Japan, May 22, 2025 -

Seiko Epson Corporation (TSE: 6724, "Epson") has developed the M-A370AD10 as a compact, low-noise 3-axis accelerometer ideal for addressing societal issues resulting from things such as the increase in natural disasters and aging infrastructure. This product provides extremely accurate and precise data for earthquake observation, continuous microtremor measurement, and infrastructure aging monitoring, enabling early anomaly detection and a rapid response. Incorporating this product into systems can also significantly enhance their reliability. Mass production of this accelerometer is scheduled to begin in July 2025.

The M-A370AD10 offers noise performance below the USGS New High Noise Model¹. This low-noise performance is enabled by Epson's proprietary microfabrication technology² and digital IP technology³. This device also offers high bias stability and a wide dynamic range, making it excellent for the detection of micro-seismic signals imperceptible to humans, ground structure exploration using ambient vibration measurements, and long-term tilt monitoring of buildings.

This product's low power consumption and digital output also make it possible to construct simpler measurement systems than is possible with conventional systems that use analog output sensors. Epson is accelerating digital transformation by expanding its lineup of embeddable accelerometers, enhancing system reliability, and contributing to the development of safe and resilient social infrastructure by mitigating risks associated with natural disasters and aging facilities.

• ¹ A standard set by the United States Geological Survey (USGS) to evaluate the quality of data recorded by seismometers.
• ² A microfabrication process is used to produce quartz crystal units (resonators) that detect acceleration.
• ³ Digital circuit technology that detects frequencies quickly and accurately.

• Low noise: 0.02 µG/√Hz (1 Hz to 10 Hz)
• High bias stability: ±0.5 mG (-30°C to 85°C), ±0.1 mG (1 year at 25°C)
• High dynamic range: ±10 G
• High-sensitivity detection from DC⁴; amplitude response of ±0.4 dB
• Stable phase characteristics with phase response of ±0.1°
• Low power consumption with 3.3V and built-in A/D converter, enabling simple embedded system constructionStable phase characteristics with phase response of ±0.1°
• Synchronization of multiple nodes via external trigger⁵, GNSS⁶ synchronization via 1PPS signal⁷
• Built-in sensitivity self-diagnosis test function
• High reliability: MTTF⁸ of 87,600 hours (approximately 10 years)
• Backward compatibility with M-A352AD10

• ⁴ Abbreviation for Direct Current.
• ⁵ Obtaining data from multiple sensors simultaneously.
• ⁶ Abbreviation for Global Navigation Satellite System.
• ⁷ A pulse signal output at one-second intervals from devices such as GPS receivers.
• ⁸ Abbreviation for Mean Time To Failure. The average time until a product fails.

Target Applications

Earthquake detection, resource exploration, ambient vibration (microtremor) exploration, underground structure exploration, tilt measurement, building health monitoring, vibration analysis, control, and stabilization, etc.

Related Link

For more detailed information about the product, please refer to the following webpage.

https://global.epson.com/products_and_drivers/sensing_system/

Customer Inquiries

MD Product Marketing Group, MD Sales & Marketing Department, Seiko Epson Corporation

https://global.epson.com/products_and_drivers/sensing_system/contact/global.html

Detailed Information

You can download materials summarizing the features and providing comparisons of Epson's accelerometers and comparison methods. Please feel free to contact us for further details.

https://global.epson.com/products_and_drivers/sensing_system/offer/

Exhibition Participation

Epson will exhibit at Japan Geoscience Union Meeting 2025. This event will be held at Makuhari Messe from May 25 to May 30, 2025. We plan to showcase our new products at the Epson booth.

Exhibition Link

Japan Geoscience Union Meeting 2025

https://www.jpgu.org/meeting_e2025/

Comparison of Specifications Between the New and Existing Product

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